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PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

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    Buy cheap PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer from wholesalers
     
    Buy cheap PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer from wholesalers
    • Buy cheap PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer from wholesalers
    • Buy cheap PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer from wholesalers

    PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

    Ask Lasest Price
    Brand Name : Easun
    Model Number : ES225
    Certification : Rosh, Reach
    Price : Negotiable
    Payment Terms : T/T
    Supply Ability : 4000000
    Delivery Time : 3-8 working day
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    PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

    PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer


    Product model: ES225


    TPU Hot Melt Adhesive Powder Description: hot melt adhesive powder of thermoplastic polyurethane. It has a soft feel and good resilience, stretching; easy processing; It has excellent bonding properties for textiles.


    Function:Heat transfer,Digital printing,Silk screen printing.


    Physical Characteristics:


    PropertyCriterion
    AppearanceWhite powder
    CompositionTPU
    Density ASTM D-7921.18±0.03 g/cm³
    Melt Point DSC100-120 ℃
    Melt Index ASTM D-123875±2 Shore A
    Powder size range0-80 um
    80-200 um
    150-250 um

    Technical Parameters:


    Bonding parameters (for reference only)Temperature115-130℃
    Press0.5-1.5 kg/cm2
    Time8-15S
    Washing Resistance40℃Excellent
    60℃/
    90℃/

    Packaging and Storage Conditions:

    Packaging20KG in one PE bag+Brown paper bag
    Storage ConditionsStored in dry unopened packaging at room temperature for 12 months. High temperature and pressure will cause agglomeration. The trays cannot be double-pressed.


    1. Bonding temperature and pressure and time relate to the bonding strength of the film to the material. The bonding temperature must be close to the temperature set by the machine, the pressure must be uniform, and the mold and press rolls must be flat.

    2. The bonding conditions used will vary between machines and materials. The conditions indicated here are only basic. The most ideal bonding conditions should be established by manufacturing for the specific application.


    PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer

    PU DTF Hot Melt Adhesive Powder For DTF Heat Transfer


    Product Tags:

    DTF Hot Melt Adhesive Powder

      
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